Profile® II Depth Filters for CMP Applications

High-Efficiency Depth Filters for CMP Application Filtration

Profile II depth filter cartridges for chemical mechanical processing (CMP) applications effectively remove agglomerated particles and gels from oxide, tungsten and copper slurries without disturbing particle distribution. The steep efficiency curves in these filters result in minimal strip-out of desirable slurry particles while sharply increasing the removal of oversized particles.

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Availability

In Stock

Product Type

Metal Filters

ELEMENT, BONDED 105 MICRON product photo

ELEMENT, BONDED 105 MICRON

Product ID: 30596
Unit of Measure
1/EA
Min Order Qty
1
2PSS,W.S.,316SST,GR D,1/8 T product photo

2PSS,W.S.,316SST,GR D,1/8 T

Product ID: P2500190
Unit of Measure
1/IN2
Min Order Qty
1
S120242FS100-14 product photo

S120242FS100-14

Product ID: S120242FS10014
Unit of Measure
1/EA
Min Order Qty
1
S70171H550-100 product photo

S70171H550-100

Product ID: S70171H550100
Unit of Measure
1/EA
Min Order Qty
1
PP FLANGE ASSY STYLE A product photo

PP FLANGE ASSY STYLE A

Product ID: T8311100
Unit of Measure
4/EA
Min Order Qty
4
PSP09-10-S-DOE/8061135000 product photo

PSP09-10-S-DOE/8061135000

Product ID: DP1000HDOH09A
Unit of Measure
1/EA
Min Order Qty
1
DXXJ40M04730 product photo

DXXJ40M04730

Product ID: DXXJ40M04730
Unit of Measure
1/EA
Min Order Qty
1

PSS® Plus Series Junior Style Metal Elements, MCS4463PAHJ7BOX

Product ID: MCS4463PAHJ7BOX
Unit of Measure
1/EA
Min Order Qty
1
Filter Media
316 L Stainless Steel
Gasket Seal
Ethylene Propylene Steam Service
Maximum Differential Pressure
5.1 bard (73 psid) to 93.3 °C (200 °F)
Nominal Length (Imperial)
5.2 in
Recommended Maximum Flow Density
11 LPM/5.2
Removal Efficiency
99.9 %
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8 Items
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Description

Why choose CMP depth filter cartridges?

These depth filters are available in removal ratings from 0.2 to 40 µm, which are five to 10 times finer than traditional depth filter ratings. They also include a continuously profiled pore structure for built-in prefiltration.

Applications

Microelectronics:

  • Chemical mechanical processing (CMP)

Specifications

*Please refer to the documentation for additional specifications.

 

Removal Ratings

 

  • 0.2 µm, 0.3 µm, 0.5 µm, 1 µm, 3 µm, 5 µm, 10 µm, 20 µm, 30 µm and 40 µm 

 

Pressure Drop vs. Liquid Flow Rate1

 

1 For liquids with viscosities differing from water, multiply the pressure drop by the viscosity in centipoise.

Documents

Data Sheets

  • Profile® II Filters for CMP Applications

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