Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Industries

Microelectronics

PolyFine-II Filter Cartridge, Highly asymmetric polysulfone, 0.2 µm, 10 in, EPDM, M3 product photo

PolyFine-II Filter Cartridge, Highly asymmetric polysulfone, 0.2 µm, 10 in, EPDM, M3

Product ID: PFT0210UEM3513
Unit of Measure
1/EA
Min Order Qty
1
Micron
0.2 µm

PUY01ZU010ZJ

Product ID: PUY01ZU010ZJ
Unit of Measure
1/EA
Min Order Qty
1

CRTG PUY1J006J

Product ID: PUY1J006J
Unit of Measure
1/EA
Min Order Qty
1

PUY2U220ZJ

Product ID: PUY2U220ZJ
Unit of Measure
1/EA
Min Order Qty
1

PUY2UY045J

Product ID: PUY2UY045J
Unit of Measure
1/EA
Min Order Qty
1

PUY3UY045J

Product ID: PUY3UY045J
Unit of Measure
1/EA
Min Order Qty
1

CRTG R19F300

Product ID: R19F300
Unit of Measure
24/EA
Min Order Qty
24

R2F020

Product ID: R2F020TIMONIUM
Unit of Measure
24/EA
Min Order Qty
48

R2F030

Product ID: R2F030TIMONIUM
Unit of Measure
24/EA
Min Order Qty
48

R2F050

Product ID: R2F050TIMONIUM
Unit of Measure
24/EA
Min Order Qty
24

R2F700

Product ID: R2F700TIMONIUM
Unit of Measure
24/EA
Min Order Qty
48

R4F030

Product ID: R4F030TIMONIUM
Unit of Measure
1/EA
Min Order Qty
1

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)

Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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