Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Microelectronics

MCY1001W003J 254

Product ID: MCY1001W003J254
Unit of Measure
1/EA
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1

Nexis® T Filter Cartridges, Removal Rating 200 μm, Polypropylene, EPDM, DOE with elastomer gasket seals and end caps

Product ID: NXT200TFUDOEE47
Unit of Measure
5/EA
Min Order Qty
5
Removal Rating
200 µm
Membrane Material
Polypropylene
Gasket / O-Ring Material
EPDM
End Configuration Code
DOE
End Configuration
DOE - DOE with elastomer gasket seals and end caps
Cartridge Type
NXT
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CMC 10 (6161)

Product ID: CMC106161
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1/EA
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1
FSL315CAP 204 product photo

FSL315CAP 204

Product ID: FSL315CAP204
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1/EA
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1
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G005AW30S-1PK

Product ID: G005AW30S1PK
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1/EA
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1
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G0.5AW20S-1PK

Product ID: G05AW20S1PK
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1/EA
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Individually wrapped
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G030AW50S-1PK

Product ID: G030AW50S1PK
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G0.5A10S-1PK

Product ID: G05A10S1PK
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G075A10S-1PK

Product ID: G075A10S1PK
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1/EA
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IDL11GN16H

Product ID: IDL11GN16H
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1/EA
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IJFM2D71

Product ID: IJFM2D71TIMONIUM
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1/EA
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IJFM3B71

Product ID: IJFM3B71TIMONIUM
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1/EA
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445 Items

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

*Please refer to the documentation for additional specifications.

 

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)
Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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