Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Industries

Microelectronics

Gasket / O-Ring Material

FEP encapsulated fluorocarbon elastomer (O-rings)

NXT 10-10U-M3F product photo
Unit of Measure
60/EA
Min Order Qty
60
Micron
10 micron
NXT 1-10U-M3F product photo
Unit of Measure
1/EA
Min Order Qty
1
Micron
1 micron
NXT 200-10U-M8F product photo
Unit of Measure
30/EA
Min Order Qty
30
Micron
200 micron
NXT 3-10U-M3F product photo
Unit of Measure
60/EA
Min Order Qty
60
Micron
3 micron

Nexis® T Filter Cartridges, Removal Rating 5 μm, Polypropylene, Length 10 inches, FEP encapsulated Fluorocarbon Elastomer Orings, SOE flat closed end external 222 O-rings

Product ID: NXT510UM3F
Unit of Measure
30/EA
Min Order Qty
30
Removal Rating
5 µm
Membrane Material
Polypropylene
Cartridge Length (Imperial)
10 in
Cartridge Length (Metric)
254 mm
Cartridge Length (Metric)
25.4 cm
Gasket / O-Ring Material
FEP encapsulated fluorocarbon elastomer (O-rings)
See All Attributes

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)

Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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