Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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DFT Classic®, Filter Cartridges, Removal Rating 30 μm, Length 20 Inches, 316 stainless steel product photo

DFT Classic®, Filter Cartridges, Removal Rating 30 μm, Length 20 Inches, 316 stainless steel

Product ID: G030AW20S1PK
Unit of Measure
1/EA
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Packaging
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10P30U

Product ID: 10P30U
Unit of Measure
20/EA
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1C30S

Product ID: 1C30S
Unit of Measure
20/EA
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20

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200NC30U

Product ID: 200NC30U
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20/EA
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20C30A-EA

Product ID: 20C30AEA
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20/EA
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Product ID: 20U10U
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3L1025W40A product photo

3L1025W40A

Product ID: 3L1025W40A
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1/EA
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Bulk
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5P40U

Product ID: 5P40U
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1/EA
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SUPRAdisc SDT 950 300T950C416VP product photo

SUPRAdisc SDT 950 300T950C416VP

Product ID: 7006071
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SUPRAdisc SD 900 300X900C516VP product photo

SUPRAdisc SD 900 300X900C516VP

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HDC® II Filter Cartridges, Removal Rating 4.5 μm, Length 20 inches, 222 Finned end

Product ID: AB2J0458PH1
Unit of Measure
1/EA
Min Order Qty
1
Removal Rating
4.5 µm
Cartridge Length (Imperial)
20 in
Cartridge Length (Metric)
508 mm
Cartridge Length (Metric)
50.8 cm
Cartridge Outer Diameter (OD) (Imperial)
2.75 in
Cartridge Outer Diameter (OD) (Metric)
7 cm
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Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

*Please refer to the documentation for additional specifications.

 

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)
Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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