Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Product Type

Accessories and Spare Parts

HC8420-A5V50CVR ASSEMBLY COVER

Product ID: HC8420-A5V50CVR
Unit of Measure
1/EA
Min Order Qty
1

HC9000A104HSS ASSEMBLY PLUG

Product ID: HC9000A104HSS
Unit of Measure
1/EA
Min Order Qty
1

HC9000A104H ASSEMBLY PLUG

Product ID: HC9000A104H
Unit of Measure
1/EA
Min Order Qty
1

HC9000A104Z

Product ID: HC9000A104Z
Unit of Measure
1/EA
Min Order Qty
1

HC9020SBOWLR SPARE BOWL

Product ID: HC9020SBOWLR
Unit of Measure
1/EA
Min Order Qty
1

HC9020SBOWLS SPARE BOWL

Product ID: HC9020SBOWLS
Unit of Measure
1/EA
Min Order Qty
1

HC9858-3A50 VLV RELIEF

Product ID: HC98583A50
Unit of Measure
1/EA
Min Order Qty
1

HC9856-3A70Y310

Product ID: HC98563A70Y310
Unit of Measure
1/EA
Min Order Qty
1

STRINGWOUND FILTER

Product ID: FPY5R10S
Unit of Measure
1/EA
Min Order Qty
1

BREATHER FILTER

Product ID: FS05025
Unit of Measure
6/EA
Min Order Qty
6

UH319SKH

Product ID: FUH319SKH
Unit of Measure
1/EA
Min Order Qty
1

G020AW30S-1PK

Product ID: G020AW30S1PK
Unit of Measure
10/EA
Min Order Qty
10

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)

Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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