Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

Order Products

Product Type

Large Format Filters

Unit of Measure
4/EA
Min Order Qty
4
Unit of Measure
4/EA
Min Order Qty
4

Ultipleat® High Flow, Large Format Filters, Filter Grade 10 µm, High-Area Polypropylene Structure, Length 20 Inches

Product ID: HFU620J100JU
Unit of Measure
4/EA
Min Order Qty
4
Unit of Measure
4/EA
Min Order Qty
4

Ultipleat® High Flow, Large Format Filters, Filter Grade 20 µm, High-Area Polypropylene Structure, Length 20 Inches

Product ID: HFU620J200J
Unit of Measure
4/EA
Min Order Qty
4

Ultipleat® High Flow, Large Format Filters, Filter Grade 2 µm, Pleated Polypropylene Depth Structure, Length 20 Inches

Product ID: HFU620UY020H1
Unit of Measure
4/EA
Min Order Qty
4
Unit of Measure
8/EA
Min Order Qty
8
Unit of Measure
4/EA
Min Order Qty
4
Unit of Measure
4/EA
Min Order Qty
4

Ultipleat® High Flow, Large Format Filters, Polypropylene, Length 20 Inches

Product ID: HFU620UY020JUW
Unit of Measure
1/EA
Min Order Qty
1
Unit of Measure
4/EA
Min Order Qty
4
Unit of Measure
4/EA
Min Order Qty
4

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)

Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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