Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Metal Filters

PSS-M,D,1/16,2.116DIA product photo

PSS-M,D,1/16,2.116DIA

Product ID: PSSMD1162116DIA
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1/EA
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S120242FS100-14

Product ID: S120242FS10014
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1/EA
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S60141H550-100-W

Product ID: S60141H550100W
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S70171H550-100

Product ID: S70171H550100
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1/EA
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S70172FS100-075-3M-2

Product ID: S70172FS1000753M2
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C-14-06-1S200

Product ID: C14061S200
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C-14-06-1S100

Product ID: C14061S100
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C-23-19-6PH product photo

C-23-19-6PH

Product ID: C23196PH
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PSS® Plus Series Metal Elements

Product ID: MBS1001PAHJ7
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1/EA
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Adaptor
Double Open End, Flat Gasket
Filter Media
316 L Stainless Steel
Gasket Seal
Ethylene Propylene Steam Service
Maximum Differential Pressure
75 psid forward and reverse @ 200° F (93.3°C)
Nominal Length (Imperial)
10 in
Removal Efficiency
99.98 %
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MBS1001RMH product photo

MBS1001RMH

Product ID: MBS1001RMH
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1/EA
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1
CARTRG MBS1001S050H2 product photo

CARTRG MBS1001S050H2

Product ID: MBS1001S050H2
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1/EA
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1
MBS1002P05H product photo

MBS1002P05H

Product ID: MBS1002P05H
Unit of Measure
1/EA
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1

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)

Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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