Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Metal Filters

PSP05-10-S-DOE/8061076000 ST product photo

PSP05-10-S-DOE/8061076000 ST

Product ID: DP1000HDOH05A
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PSP09-10-S-DOE/8061135000

Product ID: DP1000HDOH09A
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PWC40-10-S-DOE/8101085000

Product ID: DP1000HDOH040
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PWC70-10-S-DOE/8101105000 ST product photo

PWC70-10-S-DOE/8101105000 ST

Product ID: DP1000HDOH070
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PWC10-10-S-DOE ST product photo

PWC10-10-S-DOE ST

Product ID: DP1000HDOH010
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PWC250-10-S-DOE/8101210000 ST product photo

PWC250-10-S-DOE/8101210000 ST

Product ID: DP1000HDOH250
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PWC140-10-S-DOE/8101126000 product photo

PWC140-10-S-DOE/8101126000

Product ID: DP1000HDOH140
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PSP04-10-S-DOE/8061055000 ST product photo

PSP04-10-S-DOE/8061055000 ST

Product ID: DP1000HDOH64S
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DXXJ40M04730

Product ID: DXXJ40M04730
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FILTER DISC, .245 DIA., 17 MIC product photo

FILTER DISC, .245 DIA., 17 MIC

Product ID: 2002024517
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FILTER DISC, .393 DIA, 17 MIC product photo

FILTER DISC, .393 DIA, 17 MIC

Product ID: 2002039317
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B-12-18-F product photo

B-12-18-F

Product ID: B1218F
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83 Items

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

*Please refer to the documentation for additional specifications.

 

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)
Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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