Profile® Nano Depth Filter Cartridge

For CMP Applications in Microelectronics

Profile Nano advanced depth filter cartridges are high-performance slurry filters that classify ceria and low solids colloidal silica slurries. They are used in chemical mechanical planarization (CMP) processes such as shallow trench isolation (STI) and barrier copper.

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Availability

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Filter Media

Highly Asymetric Polysulfone

PolyFine-II Filter Cartridge, Highly asymmetric polysulfone, 0.2 µm, 10 in, EPDM, M3 product photo

PolyFine-II Filter Cartridge, Highly asymmetric polysulfone, 0.2 µm, 10 in, EPDM, M3

Product ID: PFT0210UEM3513
Unit of Measure
1/EA
Min Order Qty
1
Micron
0.2 µm
Poly-Fine® II, Filter Cartridges, Removal Rating 0.2 μm, Highly Asymetric Polysulfone, Length 20 Inches, EPDM product photo

Poly-Fine® II, Filter Cartridges, Removal Rating 0.2 μm, Highly Asymetric Polysulfone, Length 20 Inches, EPDM

Product ID: PFT0220UE
Unit of Measure
1/EA
Min Order Qty
1
Micron
0.2 µm
Poly-Fine® II, Filter Cartridges, Removal Rating 0.2 μm, Highly Asymetric Polysulfone, Length 4 Inches, Fluorocarbon Elastomer product photo

Poly-Fine® II, Filter Cartridges, Removal Rating 0.2 μm, Highly Asymetric Polysulfone, Length 4 Inches, Fluorocarbon Elastomer

Product ID: PFT024UV
Unit of Measure
1/EA
Min Order Qty
1
Micron
0.2 µm
3 Items
  • 1

Description

Why choose Profile Nano depth filter cartridges for CMP applications?

 

These CMP filters efficiently remove particles as fine as 100 nm with the help of extremely fine fibers manufactured via a highly advanced melt-blowing process.

 

Additional benefits include:

 

  • High removal efficiency for particles predominantly captured by sieving and other mechanical filtration mechanisms
  • Each zone is manufactured to a given specification, ensuring consistent and reproducible performance
  • Steep efficiency curves result in minimal strip-out of desirable slurry particles while sharply increasing removal of oversized particles

Product Highlights: 

  • Higher performance
  • For fine particle removal
  • Includes multi-zone pore construction
  • Longer service life

Applications/Use

Microelectronics:

  • Semiconductor – CMP

Specifications

*Please refer to the documentation for additional specifications.

 

Materials
  • Medium: Polypropylene
  • Core, cage, and endcaps: polypropylene
  • O-ring options: ethylene propylene (EPR)
Removal ratings
  • 100 nm
Configurations
  • Nominal length:

             102 mm / 4 in, 254 mm / 10 in, 508 mm / 20 in, 762 mm / 30 in, 1016 mm / 40 in

  • Diameter:

             63 mm / 2.5 in

  • O-ring size / end caps:

             Code 19 (222 double O-ring flat end)
Operating conditions
  • Maximum operating temperature: 
             82°C / 180°F
  • Maximum differential pressure:

            0.41 MPa @ 30°C / 60 psid @ 85°F

            0.34 MPa @ 50°C / 50 psid @ 120°F

            0.2 MPa @ 70°C / 30 psid @ 160°F

            0.1 MPa @ 82°C / 15 psid @ 180°F

Documents

Data Sheets

  • Profile® Nano Filters for CMP Applications

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